Take the guesswork out of test system development—Impact ES delivers complete, turnkey solutions tailored to your product and production needs. We designs and build electronics test systems that help manufacturers protect quality, keep production moving, and reduce risk from prototype through full-rate production.
From schematic to shipping, Impact Electronic Solutions owns the entire test development process, so your engineers can stop firefighting and get back to designing. We analyze your design files, build the test strategy, design and fabricate custom fixtures, integrate everything into production, and deliver fully validated, traceable boards ready to scale.
The result is a single, cohesive system that prevents escapes, stabilizes schedules, and shortens troubleshooting when issues do appear—combining ICT-style flying probe coverage, functional test, custom production fixturing, and serial-number-level traceability into one handoff your manufacturing team can actually run with.
End-to-end test system development: hardware and software, built together to verify performance from prototype through full production
Comprehensive PCBA test methods: flying probe (ICT-style) and functional test for full-board coverage.
Custom production fixtures: engineered for speed, repeatability, and automation at scale
Traceability built in: pass/fail reporting and serial-number-based records you can audit at any point
Whether you're launching a prototype or ramping to volume, every board ships proven.
Test system development is the process of designing the hardware, software, and procedures used to validate electronic products during manufacturing. These systems help ensure each product functions correctly before it leaves the production line.
A typical test system may include custom fixtures, automated software sequences, measurement instruments, and reporting tools that verify electrical performance, firmware operation, and system functionality.
Well-designed test systems help manufacturers identify defects early, improve product reliability, and maintain consistent quality as production scales.
End-to-End Test Solution Development: We design and deliver complete test systems, including test plans, fixtures, and software, ready for production use.
Design File Review & Test Strategy Creation: We extract key test points and functionality from your schematics, BOMs, and layouts to build a targeted, efficient test plan.
Custom Test Fixture Design & Fabrication: Fixtures are engineered for your specific PCBA or system, whether you need a simple bed-of-nails setup or a fully integrated functional test station.
PCBA Test Method Selection & Deployment: We layer flying probe (ICT-style) and functional testing to match your product stage and volume — fixtureless coverage for new designs and early revs, dedicated fixtures and bed-of-nails interfaces as you scale.
Production Documentation & Operator Handoff: Work instructions, training-ready procedures, and validation records that let your manufacturing team take the system live without back-channel support from engineering.
Integration with Contract Manufacturing (CM): Your product can be built and tested at our site without the need to develop your own test infrastructure.
Electrical & Functional Testing
Power measurements (voltages, currents, sequencing)
Continuity checks, open/short detection
Sensor and peripheral checks
Embedded System Test Support
Programming of MCUs, FPGAs, EEPROMs, and Flash
Interface testing using SPI, I2C, UART, USB, CAN, etc.
Firmware validation and version control
Automation & Reporting
Configurable test scripts and user interfaces
Automatic test logging per unit via unique serial numbers
Repeatable and operator-independent test procedures
PCBA Test Methods
Flying probe (ICT-style, fixtureless) for new designs and low-to-medium volumes
Custom bed-of-nails fixtures for higher-throughput production
Functional test for powered-on behavior, I/O, and real system performance
Layered ICT + functional strategies to maximize coverage
Defect Detection Coverage
Opens, shorts, polarity, missing or wrong components
Solder defects, unsoldered pins, component value verification
Programming and firmware-level faults
Functional issues that only appear under power
Portable & Multi-Site Capable
Test stations engineered to deliver identical test intent across multiple manufacturing locations
Standardized reporting and traceability that hold up across sites
Review requirements and design data: understand product intent, interfaces, constraints, and success criteria.
Define test strategy: select methods (ICT-style, functional, or both) and map coverage to risks.
Design the interface: create fixtures, harnessing, and safe, repeatable connections to the UUT.
Build automation: develop sequences, operator guidance, and safeguards for consistent execution.
Validate and release: debug, confirm measurement integrity, document procedures, and support production handoff.
Flying probe (ICT-style) is a strong fit: when designs are new or changing and you need quick, fixtureless coverage for common build defects.
Custom fixtures are a strong fit: when you need more repeatability, faster test cycles, and an operator-friendly interface for ongoing manufacturing.
Functional testing is essential: when you need to validate powered-on behavior, firmware interaction, I/O, and real system performance.
Many programs use a layered approach: ICT-style checks to confirm build integrity, plus functional test to confirm real operation.
Flying probe testing is a flexible way to validate PCBAs without investing in a dedicated fixture. Instead of a bed-of-nails interface, a flying probe system uses programmable probes that contact points on the board directly—making it a strong option for new designs, early revs, and low-to-medium volumes.
A typical flying probe program can identify issues such as:
Shorts and opens
Component values
Polarity issues
Unsoldered pins
At Impact, flying probe is commonly used during early-stage builds and lower-volume production as part of an overall, layered test strategy. Programming and test times vary based on design complexity, coverage requirements, and access to test points.
In practice, flying probe often uncovers missing components, polarity issues, and solder-related defects. As designs stabilize and volumes increase, we deploy dedicated fixtures where they improve throughput and operator workflow — reducing touch time and test time while maintaining coverage and traceability.
When production ramps up, speed and repeatability start to matter as much as coverage. Custom fixtures, called bed-of-nails fixtures, use spring-loaded probes to contact defined test points on the PCB so operators can test units quickly and consistently, shift after shift.
Benefits include:
Higher throughput: shorter test cycles for production environments.
Better repeatability: consistent alignment and controlled contact force.
Deeper automation: reliable interfaces for programming, measurement, and data logging.
A dedicated fixture is usually the right investment when your design is stable and you need faster test cycles, more consistent operator results, or stronger traceability. Teams commonly choose fixtures when the operational benefits, reduced touch time, fewer retests, and more repeatable measurements, justify the upfront design and build effort.
Typical development effort: fixture programs generally include mechanical design, probe selection, wiring, safety interlocks, and software integration, followed by debug and validation.
Common design challenges: limited access to test points, tight component clearances, board variation, connector wear, and ensuring repeatable alignment.
What customers gain: improved throughput, reduced operator variability, clearer pass/fail decisions, and more consistent quality data for continuous improvement.
Functional Testing vs In-Circuit Testing (ICT)
In-circuit test (ICT) focuses on electrical integrity at the component and net level — confirming things like opens/shorts, polarity, and expected values. Functional test validates real behavior with the assembly powered on, running firmware, and interacting with inputs/outputs the way it will in the field.
For many products, the best approach is a layered strategy: use ICT-style checks (like flying probe) to catch build defects early, then use functional testing to confirm the product performs as intended.
Our test strategy focuses on functional testing and ICT-type coverage methods such as flying probe. For higher-volume programs, we evaluate and deploy dedicated fixture-based solutions as needed to align with production scale, cycle-time targets, and coverage requirements.
What functional test catches that powered-off ICT may miss: Because flying probe and many ICT checks happen with the board powered off, they're great at finding assembly defects — but they typically won't confirm that a component or subsystem performs correctly under real operating conditions. Functional testing, run with the unit powered on, is better at identifying true behavior and performance issues.
When each method is used: A layered strategy delivers the strongest outcome. ICT-type coverage methods such as flying probe confirm the build is electrically correct, while functional test verifies the product operates as intended. Together, they reduce escapes, rework, and long-term field issues.
Free up your internal team to focus on product innovation while we handle the complexities of test system development.
Our traceable, standards-aligned testing processes support compliance in highly regulated industries such as medical, aerospace, and automotive.
Adaptable test infrastructure that grows with your needs—from prototypes and pilot runs to full-scale production.
Ensure a smooth transition from PCBA design to manufacturing with no gaps in test coverage or process readiness.
Enter production with fully validated, ready-to-run test systems—no delays, no guesswork.
We have been recognized by numerous publications and organizations for our consistent quality and devotion to our customers.
We start with schematics and the BOM to understand intent and critical components, then review PCB layout and assembly data to confirm access to test points and interfaces. When available, firmware requirements and system-level specifications define functional coverage and acceptance criteria.
Timelines vary based on product complexity and how production-ready the system needs to be. Aligning requirements, access points, and success criteria early is the fastest way to keep development moving and protect the build schedule.
Products with high reliability, traceability, or safety expectations often require deeper coverage, stronger documentation, and tighter process control.
Depending on the stage and method, testing can uncover opens/shorts, wrong or missing components, solder defects, programming issues, and functional faults that appear under power while exercising inputs/outputs.
ICT-style tests focus on electrical integrity at the component and net level (often powered off). Functional testing powers on the unit and validates real behavior, firmware interaction, and I/O under operating conditions.
Powered-off checks are excellent at finding assembly defects, but they don’t always confirm that circuits perform correctly under real operating conditions. Functional testing is better at identifying true behavior and performance issues.
Our standard approach is a layered strategy: ICT-style testing (including flying probe) confirms build integrity, and functional testing confirms real operation. Together, they reduce escapes, rework, and downstream issues.
